In the design of PCB board麗照, can be layered, pr要銀oper layout and installatio現的n of anti ESD design 吃問and implementation多開 of PCB. By adjusting the P費風CB layout, can be very goo海線d to prevent ESD. * multilaye書物r PCB is used as far as possible, th請拍e double PCB, the ground plane and pow秒拿er plane, and closely spa匠機ced signal eart船區h line spacing can reduce comm照子on mode impedan車身ce and inductance co鐘拿upling, so as to achie購樂ve the double PCB 1/10 t讀那o 1/100. For the top and 家頻bottom surfaces 音習are components, with a short connec時紅ting line.
From the human body, the envi黃少ronment and internal electronic equ外亮ipment for semicon刀相ductor chip precision electrostatic 海歌will cause damage, such a分多s through the components算河 inside the thin insulating 街東layer; a gate MOSFET lesion a間做nd CMOS compone白問nts; CMOS device triggers lock; short 分校PN junction reverse biased; short r黃跳oad to biased PN junctio生技n; active devices within the meltin校習g welding wire or wire. In order 看機to eliminate the el吧喝ectrostatic discharge (ESD) in我就terference and damag還錯e to the electron短章ic equipment, need to take a variet坐鐘y of technical means of 飛鐵prevention.
In the design of PCB員坐 board, can be l著那ayered, proper l器厭ayout and installation of an用民ti ESD design and implementation o中學f PCB. In the design pro計為cess, through the forecas河科t can be modified only to increa知聽se or decrease the vast majority東習 of design components. By ad師姐justing the PCB layout, ca少吃n be very good to prevent人藍 ESD. The following吃火 are some of the 謝校common measure.
* multilayer PCB is 服了used as far as p中靜ossible, the double PCB, the g書銀round plane and power pla林會ne, and closely spaced sign志湖al earth line spacing c笑外an reduce common mode imped章木ance and inductan黑離ce coupling, so as to a看理chieve the double PC海理B 1/10 to 1/100. As ea路區ch signal layer are close to a多南 power supply laye高些r or ground layer. For the top and bo好他ttom surfaces are compo報少nents, with a short connecting wi錯輛re and a lot of filling hi樂木gh density PCB, can consider to use 家議the inner line.
* for a double PCB章作, by closely interwoven power and熱章 ground grid. Power line 老路is close to the g做外round, between vertical and horizont鄉務al line or fill area山雜, as much as possible to conn說校ect. The size of the grid side is海笑 less than or equal to 60mm, 畫自if possible, the grid size should雪章 be less than 13mm.
* make sure that every circuit as co跳照mpact as possible.
As far as possible to all用照 connectors are put aside.
If possible, the introduction of the術化 power line from the card and away東身 from the central, to be d知是irectly influenced b師有y ESD region.
From the human body, the envi黃少ronment and internal electronic equ外亮ipment for semicon刀相ductor chip precision electrostatic 海歌will cause damage, such a分多s through the components算河 inside the thin insulating 街東layer; a gate MOSFET lesion a間做nd CMOS compone白問nts; CMOS device triggers lock; short 分校PN junction reverse biased; short r黃跳oad to biased PN junctio生技n; active devices within the meltin校習g welding wire or wire. In order 看機to eliminate the el吧喝ectrostatic discharge (ESD) in我就terference and damag還錯e to the electron短章ic equipment, need to take a variet坐鐘y of technical means of 飛鐵prevention.
In the design of PCB員坐 board, can be l著那ayered, proper l器厭ayout and installation of an用民ti ESD design and implementation o中學f PCB. In the design pro計為cess, through the forecas河科t can be modified only to increa知聽se or decrease the vast majority東習 of design components. By ad師姐justing the PCB layout, ca少吃n be very good to prevent人藍 ESD. The following吃火 are some of the 謝校common measure.
* multilayer PCB is 服了used as far as p中靜ossible, the double PCB, the g書銀round plane and power pla林會ne, and closely spaced sign志湖al earth line spacing c笑外an reduce common mode imped章木ance and inductan黑離ce coupling, so as to a看理chieve the double PC海理B 1/10 to 1/100. As ea路區ch signal layer are close to a多南 power supply laye高些r or ground layer. For the top and bo好他ttom surfaces are compo報少nents, with a short connecting wi錯輛re and a lot of filling hi樂木gh density PCB, can consider to use 家議the inner line.
* for a double PCB章作, by closely interwoven power and熱章 ground grid. Power line 老路is close to the g做外round, between vertical and horizont鄉務al line or fill area山雜, as much as possible to conn說校ect. The size of the grid side is海笑 less than or equal to 60mm, 畫自if possible, the grid size should雪章 be less than 13mm.
* make sure that every circuit as co跳照mpact as possible.
As far as possible to all用照 connectors are put aside.
If possible, the introduction of the術化 power line from the card and away東身 from the central, to be d知是irectly influenced b師有y ESD region.
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